Lead-bismuth silicate low-temperature sealing glass for optoelectronic packaging

Abstract

Optoelectronic devices, critical in telecommunications, computing, and consumer electronics, demand robust packaging solutions to protect and maintain functionality over their operational life. Traditional sealing materials often require high processing temperatures, which can damage sensitive components. Thus, there is a pressing need for low-temperature sealing glasses that can provide robust protection without compromising the integrity of the optoelectronic devices. Lead-bismuth silicate glass emerges as a superior alternative, offering a blend of low processing temperatures and excellent physical and chemical properties.